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Glue & paste
dispensing
Smart processing within a process
Dispensing technology integrated into the atom platform permits the
deposition of glue or solder paste without impeding feeder capacity or
placement performance.
Mounted directly to the placement head, and therefore leveraging
the inherent positional accuracy and control, the dispenser applies
consistent dots of glue or paste directly to the substrate prior to
component placement.
Two dispenser modules are available:
• Air/time system, to provide economic dispensing capability
• Archimedean screw technology, to deliver the ultimate in
dispensing control and performance
