integrated intelligence
  • SMT Pick and place
  • Intelligent feeders
  • software
  • Screen printer
  • Handling solution
  • Storage

Xpii2

Xpii

check box modular compact footprint
check box huge component range
check box linear motors
check box hi-resolution digital cameras
check box 'smart' nozzles
check box true 'on the fly' vision

Click on the image to enlarge

XPii is a refreshing new approach to modular pick and place. Incorporating technology from Europlacer's innovative award winning iineo platform, XPii benefits from low maintenance linear motors, high resolution digital cameras and advanced on-head optical component sensing. With these advanced features you can benefit from all the capability of iineo in a compact space and the modularity enables you to build your line to meet growing demands.

XPii uses Europlacer proven core features, such as turret head, intelligent feeders and powerful software without compromise. It is equipped with a choice of turret heads and incorporates optical sensors that can detect, on the fly, the presence of components as small as 01005 and as large as 50 x 50 mm from picking to placement. XPii will accommodate components supplied on tape, strip tape, stick and matrix tray.

The XPii -II features two rotary heads on X/Y gantries with 8 or 12 pick ups and 'Smart' nozzles.

Heads: 2 rotary heads on X/Y gantries
with 8 or 12 pick ups & 2 x 40 position ‘smart’ nozzle banks
or (1 x 40 + 1 x 20 + 1 special) in option
Rate: 26 400 cph (IPC: 20 070 cph)
30 000 cph (IPC: 22 380 cph) - Tornado head
Components:

01005 to 50x50mm
(70 x70mm and 100mm connectors with fixed camera option)

Lead Pitch:

0.3mm (QFP), 0.4mm (µBGA)
0.15mm (QFP), 0.2mm (µBGA) with fixed camera option

Lead size: 0.15mm (QFP), 0.2mm (µBGA)
0.07mm (QFP), 0.1mm (µBGA) with fixed camera option
Accuracy: standard 35µm (QFP) to 60µm (Chip)
Feeders: 92 * 8mm
PCB Length:

60 to 500mm

PCB Width: 60mm to 460mm (60 to 405mm with tray sequencer)